PCBs Produce Capability

ITEMS项目

Parameters参数

Capability制作能力

Monthly Capability

月产能

4000/月、5000m2/月

4000type/monthly     12000m2/monthly

 Board Materials

板材

常规FR4板材：生益、联茂、建滔

Normal  materials: SHENGYI.ITEQ.KB

特殊板材：罗杰斯、雅龙、ISOLA

Specials Materials: ROGERS.ARLON.ISOLA

高Tg: 生益S1000-2、联茂IT180

High TG: S1000-2、IT180

Finished Surface

表面处理

喷锡、无铅喷锡、沉金、沉锡、沉银、

镀硬金、全板镀金、金手指、镍钯金

OSP,HAL ,lead-free HASL,ENIG, Immersion Tin, Immersion Silver, Hard Gold, Platting Gold

Thickness Tolerance

成品公差控制

板厚≤1.0mm：+/-0.1mm

板厚＞1.0mm:+/-8%

Thickness≤1.0mm：+/-0.1mm

Thickness ＞1.0mm:+/-8%

金属化孔+/-3mil、非金属化孔+/-2mil

NPth:+/-3mil, pth:+/-2mil

外型公差：长度≤ 100mm, +/-0.1mm; 100 ≤长度≤300mm:+/-0.15mm

Outline Tolerance: Length ≤100mm,+/-0.1mm;100 ≤length ≤300mmm:tolerance+/-0.15mm

Technical Specification

技术参数

最小线宽/线距:2.5/2.5mil

Min Line Width/Gap:2.5/2.5mil

最小钻嘴：0.15mm

最小激光：0.1mm

Min Hole:0.15mm for Mechanical drill

Min laser hole:0.1mm

最小环：3.5mil

Min Annular Ring:3.5mil

最厚铜厚：12OZ

Max Copper Thinkness:12oz

成品最大尺寸：单双:600X1500MM

多层：580X1200MM

1-2 Layer: 600x1500mm

Multi-layer:580x1200mm

阻焊桥： ＞0.05mm

塞孔能力：0.15-0.9mm

板厚孔径比：15：1

Min Solder mask Bridge: ＞0.05mm

Plugging Via Capability:0.15-0.9mm

Aspect Raion:15:1